Call for Exhibition

What the conference is about?

Industrial informatics includes various applications of modern information technologies in production, logistics, transport, robotics, energy generation, smart living and other areas. Special focus of this year’s conference is Artificial Intelligence. The conference is organized by the Industrial Electronics Society of IEEE, the most prominent international organization in the area of modern electronics, computers and software.

Visitor Profile

The IEEE International Conference on Industrial Informatics is attended by industry experts, researchers and academics who are gathering from all regions of the world to share ideas and research results, as well as initiatives related to industrial informatics and their applications.

The attendees come to present their latest results, in one of the regular tracks and in special sessions. The list of tracks defines the broad scope of the conference:

  • Industrial cyber-physical systems and industrial agents
  • Artificial Intelligence in Industrial Applications
  • Safety and Security in Industrial Applications
  • System and Software Engineering, Runtime Intelligence
  • Robotics and Mechatronics in Industrial Applications
  • Distributed and networked control and automation systems
  • Simulation, virtual, mix and augmented reality
  • Industrial digitalisation, digital twins in industrial applications
  • Human, computer and machine interaction
  • Real-time and networked embedded computing and IoT technologies and applications
  • Factory Automation and Communication Systems
  • Technologies and infrastructures for smart grids, buildings, and cities
  • Education in engineering and industrial informatics
  • Industrial informatics tools

Numbers of visitors expected

The conference usually attracts around 250 delegates. Technical articles go through the thorough peer-review process which guarantees only high-quality contributions appear in the conference program.

Exhibition in INDIN’19

Exhibition area is located in the entrance and upper lobbies, so the participants are associating just there. Also the lunch and coffee breaks are long enough for proper discussions. We are doing our best for your business!

Exhibition package and booth buildup

Exhibition package entitles you to chosen exhibition booth location and one congress badge. The badge includes admission to all the sessions and tutorials during three conference days, lunches, coffees, a get-together party, the conference dinner and logo on the conference web page.

The booth includes 1 table, 2 chairs, 1 poster stand and electricity (230 V, 50 Hz, maximum power normally < 1 kW. If you need more, please ask).

Booths and prices

There are 19 booths, area 6 m2/each. Booths can also be combined as bigger ones.

Price is 2400 EUR + VAT 24%, which will be invoiced in advance and should be paid before 31.5.2019. Extra booth without badge is 1600 EUR + VAT 24%.

Reservations will be confirmed on “First come first served basis”.

Schedule for building up / dismantle

Time for build up will be on Monday 22th July at 12-16 PM.
Dismantle on Thursday 25 July at 16 -17 PM

Material delivery beforehand

Please, material delivery beforehand only in urgent cases. If needed: addressed to: Aalto-yliopisto, Maarintie 8, 02150 Espoo, Finland. Please mark with INDIN’19. Before sending material, please contact us

Floor and Booth plan

Please click here to download the floor plan and complete call details.

To participate, contact us.